Ruiyang Liu - NMU Engineering Technology

Dr. Ruiyang Liu teaches MET 211 Mechanics-Statics with Prof. Robert Marlor, who has provided valuable guidance in her new role within the Mechanical Engineering Technology program.

In her industry role, Ruiyang is a Principal Engineer at Tenstorrent, leading mechanical design and reliability of advanced packaging for AI chips. She has more than 10 years of experience in semiconductor product development, with expertise in finite element analysis, material characterization, and design-for-reliability. Prior to Tenstorrent, she worked on chip packaging for the M1 and M2 processors at Apple, and for phased-array RF sensors used in the world’s first terahertz automotive radar at Teradar.

Ruiyang earned her Ph.D. in Mechanical Engineering from the State University of New York at Binghamton. She currently serves as Assistant Chair of the Thermal Mechanical Simulation and Characterization Subcommittee at the IEEE Electronic Components and Technology Conference (ECTC).
 

MET 211:  Mechanics-Statics

• BS, Harbin Institute of Technology
• PhD, State University of New York at Binghamton